Product Name:2-Propenoic acid, 2-Methyl-, 2-[(hexahydro-2-oxo-3,5-Methano-2H-cyclopenta[b]furan-6-yl)oxy]-2-oxoethyl ester

IUPAC Name:2-oxo-2-({5-oxo-4-oxatricyclo[4.2.1.0³,⁷]nonan-2-yl}oxy)ethyl 2-methylprop-2-enoate

CAS:347886-81-1
Molecular Formula:C14H16O6
Purity:95%+
Catalog Number:CM622004
Molecular Weight:280.28

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Product Details

CAS NO:347886-81-1
Molecular Formula:C14H16O6
Melting Point:-
Smiles Code:CC(=C)C(=O)OCC(=O)OC1C2CC3C1OC(=O)C3C2
Density:
Catalog Number:CM622004
Molecular Weight:280.28
Boiling Point:
MDL No:
Storage:

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Photoresist
Semiconductors could be termed as the most extensively utilized substance in the modern century. Polycrystalline wafers are used to make semiconductors. A single 300-mm silicon wafer may create hundreds of chips. Photoresist coatings and materials are an essential part of their fabrication as they are the main constituents of the photolithography process during the fabrication of the semiconductors. Photoresist is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. The photoresist can transfer the required fine pattern from the photomask (mask) to the substrate to be processed through photochemical reaction and photolithography processes such as exposure and development.

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