Product Name:2-Cyclohexylpropan-2-yl methacrylate

IUPAC Name:2-cyclohexylpropan-2-yl 2-methylprop-2-enoate

CAS:186585-56-8
Molecular Formula:C13H22O2
Purity:95%+
Catalog Number:CM537679
Molecular Weight:210.32

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Product Details

CAS NO:186585-56-8
Molecular Formula:C13H22O2
Melting Point:-
Smiles Code:CC(C(OC(C)(C1CCCCC1)C)=O)=C
Density:
Catalog Number:CM537679
Molecular Weight:210.32
Boiling Point:
MDL No:
Storage:

Category Infos

Cyclohexanes
Cyclohexane is an organic compound with a chemical formula C6H12. It is a colorless liquid with a pungent odor, insoluble in water, and soluble in most organic solvents such as ethanol, ether, benzene, and acetone. Cyclohexyl fragments are a common structure in both natural and synthetic drugs. It can be used as both core structure and part of achiral side chain.
Photoresist
Semiconductors could be termed as the most extensively utilized substance in the modern century. Polycrystalline wafers are used to make semiconductors. A single 300-mm silicon wafer may create hundreds of chips. Photoresist coatings and materials are an essential part of their fabrication as they are the main constituents of the photolithography process during the fabrication of the semiconductors. Photoresist is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. The photoresist can transfer the required fine pattern from the photomask (mask) to the substrate to be processed through photochemical reaction and photolithography processes such as exposure and development.

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